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H V SC AV ER O M A I S IO P L L A N IA BL S N T E
TISP6NTP2C QUAD FORWARD-CONDUCTING P-GATE THYRISTORS PROGRAMMABLE OVERVOLTAGE PROTECTORS
*R o
TISP6NTP2C High Voltage Ringing SLIC Protector
Independent Tracking Overvoltage Protection for Two SLICs: - Dual Voltage-Programmable Protectors - Supports Battery Voltages Down to -155 V - Low 5 mA max. Gate Triggering Current - High 150 mA min. (70 C) Holding Current - Specified 2/10 Limiting Voltage - Small Outline Surface Mount Package - Full 0 C to 70 C Temperature Range Rated for Common Impulse Waveforms
Voltage Impulse Wave Shape 10/1000 10/700 2/10 Current Impulse Wave Shape 10/1000 5/310 2/10 IPPSM A 25 40 90
G1,G2
D Package (Top View)
K1 G1,G2 G3,G4 K3 1 2 3 4 8 7 6 5 K2 A A K4
MDRXAN
Device Symbol
K1
Typical TISP6NTP2C Router Application
TERMINAL ADAPTOR SLIC 1 PROCESSOR SLIC 2 TISP6NTP2C POTS 2 POTS 1
K2 A A K3
G3,G4
LINE TRANSCEIVER TRANSCEIVER LAN
AI6NTP2C
K4
SDRXAIA
............................................ UL Recognized Components
Description
The TISP6NTP2C has been designed for short loop systems such as: - WILL (Wireless In the Local Loop) - SOHO (Small Office Home Office) - FITL (Fibre In The Loop) - ISDN-TA (Integrated Services Digital Network - Terminal Adaptors) - DAML (Digital Added Main Line, Pair Gain)
How to Order
For Standard Termination Finish Order As
TISP6NTP2CDR TISP6NTP2CD
Device TISP6NTP2C
Package D (8-pin Small-Outline)
Carrier R (Embossed Tape Reeled) - (Tube)
For Lead Free Termination Finish Order As
TISP6NTP2CDR-S TISP6NTP2CD-S
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex MARCH 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6NTP2C High Voltage Ringing SLIC Protector
Description (Continued)
The systems described often have the need to source two POTS (Plain Old Telephone Service) lines, one for a telephone and the other for a facsimile machine. In a single surface mount package, the TISP6NTP2C protects the two POTS line SLICs (Subscriber Line Interface Circuits) against overvoltages caused by lightning, a.c. power contact and induction. The TISP6NTP2C has an array of four buffered P-gate forward conducting thyristors with twin commoned gates and a common anode connection. Each thyristor cathode has a separate terminal connection. An antiparallel anode-cathode diode is connected across each thyristor. The buffer transistors reduce the gate supply current. In use, the cathodes of an TISP6NTP2C thyristors are connected to the four conductors of two POTS lines (see applications information). Each gate is connected to the appropriate negative voltage battery feed of the SLIC driving that line pair. By having separate gates, each SLIC can be protected at a voltage level related to the negative supply voltage of that individual SLIC. The anode of the TISP6NTP2C is connected to the SLIC common. The TISP6NTP2C voltage and current ratings also make it suitable for the protection of ISDN d.c. feeds of down to -115 V (ETSI Technical Report ETR 080:1993, ranges 1 to 5). Positive overvoltages are clipped to common by forward conduction of the TISP6NTP2C antiparallel diode. Negative overvoltages are initially clipped close to the SLIC negative supply by emitter follower action of the TISP6NTP2C buffer transistor. If sufficient clipping current flows, the TISP6NTP2C thyristor will regenerate and switch into a low voltage on-state condition. As the overvoltage subsides, the high holding current of the TISP6NTP2C prevents d.c. latchup.
Absolute Maximum Ratings, 0 C TJ 70 C (Unless Otherwise Noted)
Rating Repetitive peak off-state voltage, VGK = 0 Repetitive peak gate-cathode voltage, VKA = 0 Non-repetitive peak on-state pulse current (see Notes 1 and 2) 10/1000 (Telcordia (Bellcore) GR-1089-CORE, Issue 2, February 1999, Section 4) 5/320 (ITU-T K.20, K.21& K.45, K.44 open-circuit voltage wave shape 10/700) 2/10 (Telcordia (Bellcore) GR-1089-CORE, Issue 2, February 1999, Section 4) Non-repetitive peak on-state current, 50 Hz/60 Hz (see Notes 1 and 2) 0.1 s 1s 5s 300 s 900 s Non-repetitive peak gate current, 1/2 s pulse, cathodes commoned (see Note 1) Operating free-air temperature range Junction temperature Storage temperature range I GSM TA TJ Tstg ITSM 7 2.7 1.5 0.45 0.43 +25 -40 to +85 -40 to +150 -40 to +150 A C C C A IPPSM 25 40 90 A Symbol VDRM VGKRM Value -170 -167 Unit V V
NOTES: 1. Initially, the protector must be in thermal equilibrium. The surge may be repeated after the device returns to its initial conditions. Gate voltage range is -20 V to -155 V. 2. These non-repetitive rated currents are peak values for either polarity. The rated current values may be applied to any cathodeanode terminal pair. Additionally, all cathode-anode terminal pairs may have their rated current values applied simultaneously (in this case the anode terminal current will be four times the rated current value of an individual terminal pair).
Recommended Operating Conditions
Component CG RS Gate decoupling capacitor Series resistor for GR-1089-CORE intra-building surge survival, section 4.5.9, tests 1 and 2 Series resistor for K.20, K.21 and K.45 coordination with a 400 V primary protector Min 100 5 10 Typ 220 50 50 Max Unit nF
MARCH 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6NTP2C High Voltage Ringing SLIC Protector
Electrical Characteristics, 0 C TJ 70 C (Unless Otherwise Noted)
Parameter ID V(BO) V(BO) VGK(BO) VF VFRM VFRM IH IGKS IGT VGT CKA Off-state current Ramp breakover voltage Impulse breakover voltage Gate-cathode impulse breakover voltage Forward voltage Ramp peak forward recovery voltage Impulse peak forward recovery voltage Holding current Gate reverse current V D = VDRM , VGK = 0 UL 497B, dv/dt 100 V/s, di/dt = 10 A/s, VGG = -100 V, Maximum ramp value = 10 A (see Note 3) 2/10 s, ITM = -27 A, di/dt = -27 A/s, RS = 50 , VGG = -100 V, (see Note 3) I F = 5 A, t w = 200 s UL 497B, dv/dt 100 V/s, di/dt = 10 A/s, Maximum ramp value = 10 A 2/10 s, ITM = -27 A, di/dt = -27 A/s, RS = 50 , (see Note 3) I T = -1 A, di/dt = 1A/ms, VGG = -100 V VGG = VGK = VGKRM, VKA = 0 I T = -3 A, t p(g) 20 s, VGG = -100 V IT = -3 A, t p(g) 20 s, VGG = -100 V f = 1 MHz, Vd = 1 V, IG = 0, (see Note 4) VD = -3 V VD = -48 V TJ = 25 C TJ = 25 C -150 -5 -50 5 6 2.5 100 50 TJ = 25 C Test Conditions TJ = 25 C Min Typ Max -5 -50 TJ = 25 C -112 -115 15 3 5 12 Unit A A V V V V V V mA A A mA mA V pF pF
2/10 s, ITM = -27 A, di/dt = -27 A/s, RS = 50 , VGG = -100 V,
Gate trigger current Gate-cathode trigger voltage Cathode-anode offstate capacitance
NOTES: 3. GR-1089-CORE intra-building 2/10, 1.5 kV conditions with 20 MHz bandwidth. The diode forward recovery and the thyristor gate impulse breakover (overshoot) are not strongly dependent of the SLIC supply voltage value (VGG). 4. These capacitance measurements employ a three terminal capacitance bridge incorporating a guard circuit. The unmeasured device terminals are a.c. connected to the guard terminal of the bridge.
Thermal Characteristics
Parameter RJA Junction to free air thermal resistance Test Conditions TA = 70 C, EIA/JESD51-3 PCB, EIA/JESD51-2 environment, Ptot = 0.52 W Min Typ Max 160 Unit C/W
MARCH 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6NTP2C High Voltage Ringing SLIC Protector
Parameter Measurement Information
PRINCIPAL TERMINAL V-I CHARACTERISTIC +i IPPSM Quadrant I Forward Conduction Characteristic GATE TRANSFER CHARACTERISTIC +iK
IFSM (= |ITSM |) IF VF VGK(BO) VGG VD ID IGT +v -i G +iG IF
-v
IH V(BO) IT ITSM Quadrant III Switching Characteristic IPPSM -i
PM6XAIC
IT IG
IK -i K
Figure 1. Principal Terminal and Gate Transfer Characteristics
MARCH 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6NTP2C High Voltage Ringing SLIC Protector
APPLICATIONS INFORMATION
SLIC Protection
The generation of POTS lines at the customer premise normally uses a ringing SLIC. Although the lines are short, a central office ringing voltage level is often required for fax machine operation. High voltage SLICs are now available that can produce adequate ringing voltage (see table). The TISP6NTP2C has been designed to work with these SLICs which use battery voltages, VBATH , down to -150 V. Figure 2 shows a typical example with one TISP6NTP2C protecting two SLICs. The table below shows some details of HV SLICs using multiple negative supply rails.
Manufacturer SLIC Series SLIC # Data Sheet Issue Short Circuit Current VBATH max. VBATL max. AC Ringing for: Crest Factor VBATH VBATR R or T Overshoot < 250 ns Line Feed Resistance 20 + 30 INFINEON SLIC-P PEB 4266 14/02/2001 110 -155 -150 85 1.4 -70 -150 -15 50 ISLICTM 79R241 -/08/2000 150 -104 -104 45 1.4 -90 -36 15 -20 50 79R101 -/07/2000 150 -104 V BATH 50 1.4 -99 -24 12 -20 50 79R100 -/07/2000 150 -104 VBATH 55 1.25 -99 -24 12 V V V mA V V V rms LEGERITYTM Unit
Assumes -20 V battery voltage during ringing. Legerity, the Legerity logo and ISLIC are the trademarks of Legerity, Inc. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies .
ISDN Protection
For voltage feed protection, the cathodes of an TISP6NTP2C thyristors are connected to the four conductors to be protected (see Figure 3). Each gate is connected to the appropriate negative voltage feed. The anode of the TISP6NTP2C is connected to the system common. Positive overvoltages are clipped to common by forward conduction of the TISP6NTP2C antiparallel diode. Negative overvoltages are initially clipped close to the negative supply by emitter follower action of the TISP6NTP2C buffer transistor. If sufficient clipping current flows, the TISP6NTP2C thyristor will regenerate and switch into a low voltage on-state condition. As the negative overvoltage subsides, the high holding current of the TISP6NTP2C prevents d.c. latchup.
Voltage Stress Levels
Figure 4 shows the protector electrodes. The package terminal designated gate, G, is the transistor base, B, electrode connection and so is marked as B (G). The following junctions are subject to voltage stress: Transistor EB and CB, SCR AK (off state) and the antiparallel diode (reverse blocking). This clause covers the necessary testing to ensure the junctions are good. Testing transistor CB and EB: The maximum voltage stress level for the TISP6NTP2C is VBATH with the addition of the short term antiparallel diode voltage overshoot, VFRM. The current flowing out of the G terminal is measured at VBATH plus VFRM. The SCR K terminal is shorted to the common (0 V) for this test (see Figure 4). The measured current, IGKS , is the sum of the junction currents ICB and IEB. Testing transistor CB, SCR AK off state and diode reverse blocking: The highest AK voltage occurs during the overshoot period of the protector. To make sure that the SCR and diode blocking junctions do not break down during this period, a d.c. test for off-state current, ID, can be applied at the overshoot voltage value. To avoid transistor CB current amplification by the transistor gain, the transistor base-emitter is shorted during this test (see Figure 5). Summary: Two tests are need to verify the protector junctions. Maximum current values for IGKS and ID are required at the specified applied voltage conditions.
MARCH 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6NTP2C High Voltage Ringing SLIC Protector
APPLICATIONS INFORMATION
CURRENT SINK
-ve
SLIC PROTECTOR RS1
+t 0 +t -ve +t
R
R
CURRENT SINK
SLIC 1
0 +t -ve +t R CURRENT SINK
RS2 VBATH
0 +t -ve +t 0 +t R CURRENT SINK ISDN POWER SUPPLY NEGATIVE SUPPLY
0V TISP6NTP2C RS3
SLIC 2
IK RS4 CG 100 nF
AI6XBNB
0V
TISP6NTP2C
AI6XDJA
Resistor "R" may be needed if sink has internal clamp diode
Figure 2. SLIC Protection
Figure 3. Protection of Four ISDN Power Feeds
0V 0V
0V ICB B (G) K IEB IGKS
1/4 T ISP
VBATH + VFRM
ICB IR A ID ID(I) K B (G)
V(BO)
1/4 TISP
6NTP2C
6NTP2C
AI6XCEB
AI6XCFB
ID(I) is the internal SCR value of ID
Figure 4. Transistor CB and EB Verification
Figure 5. Off-State Current Verification
MARCH 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6NTP2C High Voltage Ringing SLIC Protector
MECHANICAL DATA
Device Symbolization Code
Devices will be coded as below.
Symbolization Code 6NTP2C
Device TISP6NTP2C
MARCH 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6NTP2C High Voltage Ringing SLIC Protector
MECHANICAL DATA
D008 Plastic Small-Outline Package
This small-outline package consists of a circuit mounted on a lead frame and encapsulated within a plastic compound. The compound will withstand soldering temperature with no deformation, and circuit performance characteristics will remain stable when operated in high humidity conditions. Leads require no additional cleaning or processing when used in soldered assembly.
D008
4.80 - 5.00 (0.189 - 0.197)
8-pin Small Outline Microelectronic Standard Package MS-012, JEDEC Publication 95
8
7
6
5
5.80 - 6.20 (0.228 - 0.244)
INDEX
3.81 - 4.00 (0.150 - 0.157)
1
2
3
4
1.35 - 1.75 (0.053 - 0.069)
7 NOM 3 Places
0.25 - 0.50 x 45 N0M (0.010 - 0.020)
4.60 - 5.21 (0.181 - 0.205)
0.102 - 0.203 (0.004 - 0.008) 0.28 - 0.79 (0.011 - 0.031)
0.36 - 0.51 (0.014 - 0.020) 8 Places Pin Spacing 1.27 (0.050) (see Note A) 6 places 0.190 - 0.229 (0.0075 - 0.0090)
7 NOM 4 Places
44
0.51 - 1.12 (0.020 - 0.044)
DIMENSIONS ARE:
MILLIMETERS (INCHES)
NOTES: A. B. C. D.
Leads are within 0.25 (0.010) radius of true position at maximum material condition. Body dimensions do not include mold flash or protrusion. Mold flash or protrusion shall not exceed 0.15 (0.006). Lead tips to be planar within 0.051 (0.002).
MDXXAAF
MARCH 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.
TISP6NTP2C High Voltage Ringing SLIC Protector
MECHANICAL DATA
D008 - Tape Dimensions
D008 Package (8-pin Small Outline) Single-Sprocket Tape
3.90 - 4.10 (.154 - .161)
1.50 - 1.60 (.059 - .063)
7.90 - 8.10 (.311 - .319)
1.95 - 2.05 (.077 - .081) 0.8 MIN. (0.03)
0.40 (0.016)
5.40 - 5.60 (.213 - .220)
11.70 - 12.30 (.461 - .484)
6.30 - 6.50 (.248 - .256)
o
1.5 MIN. (.059)
0 MIN.
Cover Tape
Carrier Tape Embossment
Direction of Feed
2.0 - 2.2 (.079 - .087)
DIMENSIONS ARE:
MILLIMETERS (INCHES)
NOTES: A. Taped devices are supplied on a reel of the following dimensions:Reel diameter: Reel hub diameter: Reel axial hole:
330 +0.0/-4.0 (12.99 +0.0/-.157) 100 2.0 (3.937 .079) 13.0 0.2 (.512 .008)
MDXXATD
B. 2500 devices are on a reel.
"TISP" is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office. "Bourns" is a registered trademark of Bourns, Inc. in the U.S. and other countries.
MARCH 2002 - REVISED FEBRUARY 2005 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications.

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